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Semiconductor Processing Technicians
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
- Median pay
- $51,180
- per year
- 10-year outlook
- +10.9%
- Growing
- Typical entry
- High school diploma or equivalent
Key skills
- Operations Monitoring
- Reading Comprehension
- Critical Thinking
- Active Listening
- Monitoring
- Quality Control Analysis
- Speaking
- Social Perceptiveness
What they do
- Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles.
- Maintain processing, production, and inspection information and reports.
- Inspect materials, components, or products for surface defects and measure circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
- Clean semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
- Study work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
- Load and unload equipment chambers and transport finished product to storage or to area for further processing.
- Clean and maintain equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
- Place semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
- Set, adjust, and readjust computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
- Etch, lap, polish, or grind wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.
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Sources: U.S. Bureau of Labor Statistics (OEWS, Employment Projections) and O*NET, used under CC BY 4.0.